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Description
About Infinity Bond superDOT E100 Stitch and Dot Optimized Hot Melt
superDOT E100 is a premium EVA hot melt adhesive formulated for applications using hot melt stitching and dotting to reduce adhesive consumption up to 50%. It offers fast tack and excellent adhesion to cardboard, corrugated and some coated stocks. superDOT E100 also has very good high and low temperature resistance.
Bonds To
- Cardboard
- Corrugated
- Paper
- Coated Stocks
- Glass
* Free samples may be available, contact us to see if your application qualifies.
A Little about Stitch and Dot Optimized Systems
Hot melt stitching and dotting systems are not a new concept to end of line packaging applications. Dotting systems work by opening and closing the hot melt gun very quickly to create a series of hot melt dots instead of a full line. All of the space between is savings... big savings!
Hotmelt.com has now made it easier and more affordable than ever to upgrade your existing system to a money saving hot melt dotting system. The upgrade takes less than 3 hours and in some cases, the equipment and installation is free.
Common Applications for superDOT E100
- High Speed Packaging
- Semi-Automated Packaging
- Food Packaging
- Tray Forming
Features of superDOT E100
- Very Fast Hot Tack
- Excellent Heat Resistance
- Excellent Cold Resistance
- Bonds to Glass
Specifications
- Application Temperature: 325-360°F
- Viscosity: 1,100 cps @ 350°F
- Heat Stability: Excellent
- Open Time: Short
- Softening Point: 238°F
- Product Form: Chips or Pellets
